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Berlin Fintech Pliant Raises $80 Million in Series C Funding
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On 4 November 2026, Berlin-based fintech company Pliant announced an $80 million Series C funding round led by Seaya and Speedinvest, with participation from Citi Ventures and other investors. The company plans to use the capital to expand its financial...
On 4 November 2026, Berlin-based fintech company Pliant announced an $80 million Series C funding round led by Seaya and Speedinvest, with participation from Citi Ventures and other investors. The company plans to use the capital to expand its financial technology platform and strengthen its international business.
The funding highlights opportunities for financial technology providers, payment specialists, corporate finance advisers and institutional investors. HPC can support investor introductions, strategic partnerships and financial-sector business development.